化学机械研磨工艺中的减量减排Consumption Reduction in Chemical Mechanical Polish

本文通过对半导体制造工艺中化学机械研磨（chemical mechanical polish）工艺中的研磨环、氨水和纯水的使用分析

关键词： 化学机械研磨

） Abstract： Semiconductor manufacture is a high energy and resource consumption industry with high waste and pollution

This paper selects chemical mechanical polish as one typical process in wafer manufacturing to analysis the material usage condition

Then introduces the retainer ring recycling and ammonia reduction to brings our the concept that parts recycling and usage reduction can greatly help the foundries reduce the waste and pollution to environment which can realize the operation expense reduction also

Keywords： chemical mechanical polish;retainer ring;ammonia;consumption reduction 下载PDF阅读器 PDF全文下载： 初稿 （ 116 ） 作者简介： 通信联系人： 【收录情况】 中国科技论文在线： 吴端毅

 化学机械研磨工艺中的减量减排[EB/OL]

北京：中国科技论文在线

研磨环

提出晶圆厂物料循环使用与减量使用能够使企业达到节能减排

节能减排 Wu Duanyi * （ Institute of Microelectronics, SJTU

） 摘要： 半导体制造是一个高耗能

总览 评价 吴端毅 * （ 上海交通大学微电子学院